A Raritan EMX device: You can remotely locate each tagged IT device through the Raritan EMX device. 710-04840-00J EMX3 User Manual Page 3. This symbol is used throughout this manual to draw attention to topics of special importance to the. EMX User’s Manual Preface 0 Bruker strives to supply you with instructional and accurate doc-umentation. We encourage you to tell us how we are doing.

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EMX EMX System requirements Recommended hardware 64-bit CPU with AVX support, 16GB or more of memory 64-bit Linux Kernel version 2.6 or later, libc version 6 or later, libm version 6 or later, librt, and libpthread. Distribution contents The EMX distribution contains the following files. README.txt Summary of installation instructions. Emx The EMX executable emxlicense A utility for updating the EMX executable with new license files manual.pdf EMX user's manual exind.gds GDSII layout for the example inductor described in the manual exproc.proc Process file for the example inductor described in the manual flexlm Directory with FlexLM license daemon and instructions Download This is the current version of EMX (5.4).

These are all available versions of EMX. Installation instructions. Changes Changed in version 5.4.

Via merging has been changed so that by default it only merges within regions where the connected metals overlap. The old behavior where via merging happens independent of metal overlaps can be obtained with the -old-via-merge option. EMX has support for automatic collapsing of strongly-connected ports; see the manual for details. Comments in the process file that begin with ## are like -process-comment command-line options. You can use a leading - to indicate that a label should not be internal, e.g., -internal -P1.

The port-to-port resistance values shown by -print-connectivity could be slightly off if some ports on a net were grounded. This has been fixed. GDSview has an -individual-unnamed=number option (default 10).

If there are at most this many unnamed nets then, the unnamed nets have individual visibility buttons. Preliminary support for Calibre CCI integration (also requires updated Virtuoso interface). Changed in version 5.3. The if conditional operator is now allowed in region expressions.

There is a labellocations operator that can be used to get a region corresponding to the locations of labels. Various numeric improvements were made for better accuracy in the full-wave case. A bug in the local width/spacing computations that could cause a crash was fixed. A bug that could cause a pole-zero model to disagree with the DC simulation result was fixed. Changed in version 5.2. Printing the process with -print-process no longer requires a license. Cadence pins which have no access direction are now recognized and treated as internal.

This was necessary for black-boxing to work for certain PDKs. Changed in version 5.1. There is support for flipping a region of dielectrics to make it easier to make process files for things like flip-chip processes. There is a -user-comment option which will include a user-specified message in the output files. A bug which could cause a sweep to be cut off early when you specified extra frequencies in the middle of the sweep range has been fixed. Changed in version 5.0. EMX can dynamically allocate memory for solves at different frequencies.

Use -simultaneous-frequencies=0 to enable this. The size specified with -internal no longer overrides the sizes of black-box device terminals. EMX now allows frequency-dependent conductor resistances.

Resistance for merged vias given by S/m is more accurate. A new option -process-comment allows you to add annotations to the process cross-section display.

GDSview can distinguish between used and unused labels if you specify some -p options. Changed in version 4.8. Via meshing between conductors having different edge widths has been changed so that the fewer mesh elements are needed. Changed in version 4.7.

EMX now supports partially encrypted process files. See the manual for details. Having more than 32 distinct types of vias, capacitors, or resistors is now allowed. Before this could cause odd failures.

Vias defined with multiple merged layers that used ohms/via could give incorrect messages about 'no individual rectangle in shape' under some circumstances. This has been fixed. A couple of meshing bugs that could cause a crash in obscure situations have been fixed.

Changed in version 4.6. Due to a required compiler change, version 4.5 would not work on Red Hat version 5.x.

This has been fixed. Changed in version 4.5.I is now an abbreviation for -internal. EMX now prints an appropriate error message instead of crashing if the number of nonzeros in the solve preconditioner would exceed 2^32. EMX now works on CPUs with AVX2/FMA support (previous versions could crash during pole-zero model construction unless the SSE level was explicitly set).

A meshing issue that could cause a crash in the case of very long edge ports has been fixed. The tty information when a FLEXnet license is being used could be wrong or garbled; this has been fixed. The OpenGL version of GDSview no longer requires an alpha channel in the frame buffer. GDSview now only shows the used layers in the sidebar. Changed in version 4.4. Global GDSII scaling now occurs after polygon merging.

EMX prints more detail about the problem if there's something unphysical in the process file. Port ordering comments in output files include the port definition.

Changed in version 4.3. Messages from different threads are printed atomically, so the output from different threads doesn't get intermixed. Via alignment when there are lots of vias is faster.

EMX also prints the version number when printing the command line. There is a new -bottom option for having internal ports connect to the bottoms of conductors. See the manual for details. A new -supports-feature option allows auto-configuration of the Cadence interface as new features get added. There are separate label snap distances for regular labels and for labels from black-boxed devices. The new -device-label-snap-distance option controls the latter. A new -device-pins-internal option converts edge port shape pins within black-boxed devices into internal ports.

There is a -print-connectivity option for showing the ports that make up individual nets and displaying port-to-port DC resistances. A -dump-connectivity option has been added for the Cadence interface. It is used to produce LVS views that have the connectivity information and the black-boxed devices. You can then run LVS to verify that the layout and the black-box connectivity that EMX sees are consistent. A -frequency-independent option has been added.

It makes EMX use just the DC Green's functions, essentially turning it into something like a static RLC extractor. The simulation will be faster and use less memory, and PZ modeling can then be done with the -model-reduce-only option. The file that contains black-box device names can include optional Cadence bounding box information. GDSview uses this to display devices names and boundaries as a layer. GDSview now displays terminal information for generated labels in black-boxed devices. GDSview also displays net information and allows marking, unmarking, and hiding of individual nets.

Changed in version 4.2. Use of width- and spacing-dependent quantities could cause a crash in certain very complex geometries if the process stack size was too small. This has been fixed. The method of detecting whether emxmesh.m, emxcharges.m, and emxcurrent.m are running under Octave has been changed to accomodate older versions of Matlab.

The new GDSview would sometimes crash if you zoomed in very far; this has been fixed. GDSview keystrokes that affect a layer now use the topmost layer that the pointer is within if the pointer is not near an edge. Opacity keystrokes 0, 1., 9, f, and s now work inside the layout display window and apply to the pointed-to layer. The initial GDSview display was fairly slow in some cases; it should be faster now. Changed in version 4.1. EMX now shows resistor information in the -print-process output.

There is now an alternative version of GDSview with a fancier GUI. This requires a more modern set of shared libraries, including OpenGL, so the old X Windows-only version is still available. Changed in version 4.0. EMX has a new -device-cells option for black boxing specified cells in the layout. Models for the black-boxed cells can be combined with EMX's output to get a combined model for the original layout. EMX now supports a resistor declaration in the process file that lets you change the resistance of a conductor within a certain region.

User Manual

This is useful for things like doped resistors. Functions log, exp, sqrt, and pow are now allowed in numeric expressions in the process file. A race condition that could possibly cause a crash when using -full-wave in multithreaded mode has been fixed. Charge and current printing did not work properly when using -solve-for-s; this has been fixed. There is an option -uniform-sources that enforces uniform current flow into and out of source connections, instead of allowing a zero-impedance path between mesh elements within a source region. This may be more physically reasonable for wide edge ports or large internal ports.

In some rare cases, a width- and spacing-dependent bias could produce an illegal geometry which would cause a crash. GDSview now recognizes -internal and -p options like EMX. GDSview also displays a dashed boundary for internal ports. GDSview no longer shows labels on via layers. Having geometry very far from the GDSII origin would cause a crash; this has been fixed.

Changed in version 3.10. Changes in 3.9 for Octave support broke Matlab output when viewed under Windows; this has been fixed. There is a new option -local-reflex-scaling and a three-argument version of the merge operator for more control over diagonal merging of vias. See the manual for details. Changed in version 3.9.

The edge meshing for a via layer can now be specified explicitly with -edge-mesh just as for a conductor layer. A.s%dp in a Touchstone file name is now replaced with the number of ports (e.g., -s-file mycircuit.s%dp). emxmesh.m, emxcharges.m, and emxcurrent.m now work with Octave as well as Matlab. emxcharges.m and emxcurrent.m now support plotting charge and current distributions for multiple ports.

There are new options -model-s-impedance and -model-per-frequency for controlling the reference impedance used when computing pole-zero models. It is now a fatal error (instead of a warning) if a requested corner case does not exist in the process file. In some cases, EMX could produce mesh elements that were bigger than desired; this has been improved.

Changed in version 3.8. An internal port that overlaps with a via could cause a crash when using -uniform-sources. EMX now gives an appropriate error message. Memory statistic printing at -verbose=4 is a bit more informative, and the format of meshing error and warning messages is more uniform. A crash that could happen during Green's function computation for structures that were thicker vertically than horizontally has been fixed.

Changed in version 3.7. An error that could cause a crash while partitioning work among multiple processors has been fixed. Changed in version 3.6. An error that could cause a crash in the Green's function computation in rare circumstances has been fixed. Changed in version 3.5. Memory use during Green's function computation has been reduced (possibly significantly in the case of very complex process files).

A meshing issue that could occasionally lead to spurious errors about overlapping capacitors has been fixed. Changed in version 3.4. A crash that could occur in some layouts that were smaller horizontally than vertically has been fixed. Changed in version 3.3. EMX's mesh generator has been changed to give more stable results in certain examples where the vias and conductors exactly overlap (e.g., processes with thick bar vias that are being modeled as extra conductor layers). There are new -M and -G options (analogous to -m and -g) that print Matlab and Geomview meshes without stopping after the meshing phase.

Changed in version 3.2. Simulations with a discrete frequency of 0 would often fail (giving 0 for all the Y-parameters); this has been fixed. EMX now stops faster after the time limit is exceeded when using -model-max-time. GDSview includes a -font option for setting the X font.

Changed in version 3.1. A race condition which could cause a crash when using multiple discrete frequencies with -simultaneous-frequencies more than 1 has been fixed. There is a new option -no-adaptive-via-mesh which makes the via meshing behave as it did before version 2.15. There is a new -rename-labels option for renaming all the labels on a given conductor layer.

The -internal option now allows more ways of specifying the sizes of internal ports (see the manual for details). A bug that caused the pole-zero modeling to crash when the structure had no capacitive behavior has been fixed. Changed in version 3.0. EMX's SIMD support has been rewritten for greater speed, and EMX now takes advantage of the AVX extensions in newer processors.

More parts of EMX use parallelism. Meshing when via resistance is given in ohms/via is faster.

Three cases of geometric degeneracy which could cause a crash during meshing have been fixed. There is a new -signal-ground-separator option to change the separator from from a colon to a different character in case your port names include colons.

Changed in version 2.16.1. Corrects an error where GDSview was not correctly respecting the scaling in the process file. Changed in version 2.16 (this version removed; use 2.16.1). The -t option can now be used to give a thickness for a specific via (previously this only worked for conductors). The process file can now contain a 'geometry scaling' statement. Process scaling should now be handled through this mechanism rather than using the -scaling command-line option.

The -scaling option still exists but is deprecated. Changed in version 2.15. EMX now has a -case-sensitive option that keeps identifiers in the process file from all being converted to lowercase. The mesh size for vias is now automatically adjusted according to the mesh size of the connected conductors. This is helpful when you have multi-scale structures with different edge mesh sizes for different layers. GDSview now shows lines linking labels to the edges that they would snap to.

There is a new option -no-label-snap to turn off this feature, and GDSview also accepts the -label-snap-distance option used by EMX. Changed in version 2.14. Trying to use encryption with very long process files caused an error before; this has been fixed. The pole-zero model creation now uses -mode information if any is given. This can improve accuracy somewhat if there are weak couplings that you are interested in.

Changed in version 2.13. EMX can now write PDF files for viewing the process cross section. Use -generate-pdf together with -print-process.

The process cross section is scaled appropriately so that it won't run off the page, and long names are shrunk as necessary to fit the available display area. EMX now has -encrypt-process and -key options for using encrypted process files. See the manual for details. Changed in version 2.12. There is a -mask option for selecting a region of interest from the command line (similar to the emxmask statement in the process file).

When using FlexNet licensing, the -flexnet-queue option makes EMX wait for a license instead of aborting if all the licenses are already in use. Changed in version 2.11. EMX understands four new operations (interact, cut, inside, and outside) for selecting the parts of a region that overlap with a second region in various ways. See the manual for details. There is more use of parallelism in the pole-zero modeling.

This especially helps for examples with many ports when using -model-reduce-only. The S-parameter normalization when constructing models with large numbers of ports has changed.

This generally results in the creation of models with fewer poles for a given accuracy. There is a new -include-port-order option that makes EMX print the port names as a comment in output data and model files. Changed in version 2.10. A bug that could sometimes cause a FLEXnet license to not be released has been fixed. EMX can now find a FLEXnet license via environment variables INTSFTDLICENSEFILE and LMLICENSEFILE instead of requiring that the license file be stamped into the executable. A meshing bug that could cause EMX to loop endlessly has been fixed. A compilation issue that could cause a crash on some older Intel CPUs has been fixed.

There are some speed improvements which especially help in cases with lots of ports. There is a new -max-memory option for specifying a suggested memory limit for EMX.

EMX is also more aggressive about using additional memory in order to make more parallelism available when running in multi-threaded mode. See the manual for details. Pole-zero models are now rescaled to try to keep the magnitude of internal voltages more controlled. Pole-zero models can be output in Spectre's cktrom format.

Spectre simulations sometimes run faster when using this format. Changed in version 2.9.

There are more speed improvements in EMX's pole-zero model creation facility. A meshing bug which could possibly cause EMX to hang on nearly-circular shapes has been fixed. Changed in version 2.8. The pole-zero model creation facility in EMX is generally somewhat faster. Geometric degeneracies during width and spacing computation could sometimes cause a crash. This has been fixed. Changed in version 2.7.

There is a new -included-cells-file option for including only certain cells in the layout. EMX includes a new experimental ability to create passive state-space models that (approximately) match the frequency-domain simulation results. See the manual for details. Support and licensing For support or licensing questions, mail.

Hi all, I've had a look at the responses, but I'm not sure if they do what I was asking. I've used this before and as I remember its a bit like microsoft excel. Am I looking at the wrong software? How would you use it to create an RLC model?

Actually I haven't been able to get much information on this tool. Do you have any link which shows how it can accomplish what I need? As I understand it, the only ways to do it in ADS are by manually curve fitting using the tuner, or using their own pre-defined networks. Am I missing something? Manual curve fitting can be very tedious especially when the model becomes complicated.

Also, the predefined models from ADS (ladder, pi, T.) sometimes result in models which lose their physical meaning or are overly complicated. This makes it difficult to find problem areas in the circuit and modify as necessary. I figured that since all PDK inductors, capacitors and resistors (components really) need some RLC model, there would be some software which would automatically generate the parameters for a user-defined model based on S-parameters. Thanks, Aaron. There is an article at that describes an approach where the topology is also selected automatically.

This is currently available in Sonnet as an unsupported hidden feature. If you have a Sonnet license and would like to try it, you should contact Sonnet support and ask them for details. Sonnet had originally planned to introduce fitting to a pre-defined model in the current release 13 (see section III of ). However, there have apparently been unexpected problems with the implementation of this feature, so it has been postponed until release 14.

Another company that offers tools for fitting passive structures is (see also and ). In the meantime, I downloaded the trial version of IdEM from and played around with it a bit. It does not allow you to fit to a pre-defined model, but it can generate a netlist model suitable for transient simulation from S-parameter data (similar to Sonnet's Broadband Spice Extraction, see ).

The trial version of IdEM is limited to 2 ports and order 20, which should be perfectly adequate for a normal inductor. For building the model, I selected the FDVF-AS algorithm with minimum order 2 and maximum order 20. After that, I used the Hamiltonian passivity check and compensated the model if necessary. Finally, I checked the accuracy of the model and generated the Spice model. A guy from Integrand (they make EMX) came over to my company to give a talk and answer our questions.

EMX also has a model generator program, but like the others, it can only use pre-defined models. I asked him about whether or not user-defined models would be possible, and he said many customers have asked about that, but at the moment, the software just isn't at that level yet. What I understood from him about IDEM's software is that it generates a netlist using voltage-controlled sources (something along those lines anyway) etc, not user-defined models. So they are very accurate, but are really only useful for running transient analysis - not for design iteration.

Regards, Aaron.